Optimization of LTCC Structure for Stable Interconnections
IR@CEERI: CSIR-Central Electronics Engineering Research Institute, Pilani
View Archive Info| Field | Value | |
| Title |
Optimization of LTCC Structure for Stable Interconnections
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| Creator |
Kharbanda, D
Khanna, PK Kumar, S Sharma, IC |
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| Subject |
Hybrid Microcircuits
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| Description |
Reliability of electrical connections of a Low Temperature Co-fired Ceramics (LTCC) device is always a challenge. LTCC base plates are fabricated, over which a device or a sensor can be placed. Vias punched at the corners allows the provision for the electrical connection to the sensor. Conductive PdAg lines printed over the surface can be used to join the sensor part with the base plate using brazing technique. Cost of fabrication is lowered by punching the cavities using a zig fixture.
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| Date |
2013
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| Type |
Conference or Workshop Item
PeerReviewed |
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| Format |
application/msword
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| Identifier |
http://ceeri.csircentral.net/23/1/Full_Paper_MNF-2013.docx
Kharbanda, D and Khanna, PK and Kumar, S and Sharma, IC (2013) Optimization of LTCC Structure for Stable Interconnections. In: 1st National Conference on Micro and Nano Fabrication (MNF-2013), January 21-23, 2013, CMTI, Bangalore. (Submitted) |
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| Relation |
http://ceeri.csircentral.net/23/
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