Packaging of MEMS Structures using Localized Heating
IR@CEERI: CSIR-Central Electronics Engineering Research Institute, Pilani
View Archive Info| Field | Value | |
| Title |
Packaging of MEMS Structures using Localized Heating
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| Creator |
Bansal, D
Sharma, A Kaur, M Dwivedi, P Rangra, KJ |
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| Subject |
MEMS and Microsensors
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| Description |
In this paper, eutectic bonding using localized heating for micro-electro-mechanical systems (MEMS) packaging applications is described. Polysilicon line is used as a local heater. The interface of silicon and gold is used for formation of eutectic bonding. Using only 2V source, high temperature (>700ºC) in a bonding region is obtained without heating adjacent structures. Gold-silicon eutectic bond is isolated electrical connections using 1μm thick silicon dioxide layer. Device RF response has negligible effect of packaging using gold-silicon eutectic bonding till 13GHz. Hence, inbuilt custom cavity hermetic encapsulation is possible without heating device area.
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| Date |
2012
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| Type |
Conference or Workshop Item
PeerReviewed |
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| Format |
application/msword
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| Identifier |
http://ceeri.csircentral.net/34/1/33_2012%281%29.doc
Bansal, D and Sharma, A and Kaur, M and Dwivedi, P and Rangra, KJ (2012) Packaging of MEMS Structures using Localized Heating. In: Fifth ISSS National Conference on MEMS, Smart Materials, Structures and Systems, September 21-22, 2012, Institute of Smart Structures & Systems (ISSS), Karpagam University, Coimbatore. (Submitted) |
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| Relation |
http://ceeri.csircentral.net/34/
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