Effect of Temperature on Etch Rate and Undercutting of (100) Silicon using 25% TMAH
IR@CEERI: CSIR-Central Electronics Engineering Research Institute, Pilani
View Archive Info| Field | Value | |
| Title |
Effect of Temperature on Etch Rate and Undercutting of (100) Silicon using 25% TMAH
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| Creator |
Kumar, SS
Pant, BD |
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| Subject |
Sensors and Nanotechnology
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| Description |
Silicon etching using aqueous Tetra-Methyl Ammonium Hydroxide (TMAH) provides a simple and cost effective technique for the fabrication of diaphragms. The etching of {111} planes leads to undercutting, causing a deviation in the designed size of diaphragm. This induces variation in the designed characteristics of the device. It is necessary to estimate and minimize this deviation. In the present work, the etch rates in the {100} and {111} planes for 25% wt TMAH have been empirically estimated at different temperatures. Based on these results the undercut was estimated and a relationship has been established between the etch rate ratio for the two planes. These findings are extremely useful in the fabrication of silicon diaphragms with precise dimensions.
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| Date |
2013
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| Type |
Conference or Workshop Item
PeerReviewed |
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| Format |
application/pdf
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| Identifier |
http://ceeri.csircentral.net/62/1/29_2012%289%29.pdf
Kumar, SS and Pant, BD (2013) Effect of Temperature on Etch Rate and Undercutting of (100) Silicon using 25% TMAH. In: International Conference on Emerging Technologies : Micro to Nano 2013 (ETMN-2013), February 23-24, 2013, BITS, Pilani, K.K. Birla Goa Campus, Goa. (Submitted) |
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| Relation |
http://ceeri.csircentral.net/62/
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