Design and Development of hybrid Integrated MEMS Capacitive Gyroscope-ROIC Module
IR@CEERI: CSIR-Central Electronics Engineering Research Institute, Pilani
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Title |
Design and Development of hybrid Integrated MEMS Capacitive Gyroscope-ROIC Module
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Creator |
Jain, A
Gudlavalleti, RH Bose, SC Gopal, R |
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Subject |
MEMS and Microsensors
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Description |
Abstract— IU this papcr, we arc reporting rhc dcve1opm0nt of” z MEMS capacitive gyroscope-RO IC module for possible use in micro aerial vehicle (being de- veloped by CSIR-NAL). The gyroscope is fabricated using an SU-8 based UV- LIGA process. The associated ROIC is designed in-house and is fabricated through Euro-practice in AMS 0.35 qm CMOS technology. The sensor and the ROIC chips are hybrid integrated and vacuum packaged in a 24-pin dual-in-line package to make the module. The module is tested for its spectral and rate re- sponses.
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Date |
2019-12-02
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Type |
Conference or Workshop Item
PeerReviewed |
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Format |
application/pdf
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Identifier |
http://ceeri.csircentral.net/339/1/30-2018.pdf
Jain, A and Gudlavalleti, RH and Bose, SC and Gopal, R (2019) Design and Development of hybrid Integrated MEMS Capacitive Gyroscope-ROIC Module. In: International Workshop on Physics of Semiconductor Devices(IWPSD) 2017, December 11-15, 2017, New Delhi. (Submitted) |
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Relation |
http://ceeri.csircentral.net/339/
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