A Comparative adsorption study of copper on various industrial solid wastes
IR@NML: CSIR-National Metallurgical Laboratory, Jamshedpur
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| Relation |
http://eprints.nmlindia.org/2048/
http://onlinelibrary.wiley.com/doi/10.1002/aic.10206/abstract |
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| Title |
A Comparative adsorption study of copper on various industrial solid wastes
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| Creator |
Agrawal, A
Sahu, K K Pandey, B D |
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| Subject |
Waste Management
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| Description |
The adsorption behavior of Cu on three solid waste materials—sea nodule residue (SNR), fly ash (FA), and red mud (RM)—was investigated. The effects of various parameters, such as pH of the feed solution, contact time, temperature, adsorbate and adsorbent concentration, and particle size of the adsorbent, were studied for optimization of the process parameters. Adsorption of copper increased with increasing time, temperature, pH, and adsorbate concentration, and decreased with increasing initial copper concentration. The equilibrium data fit well with the Langmuir and Freundlich isotherms in the case of SNR, but not on RM and FA, because there was no appreciable effect of temperature on the metal removal on these two adsorbents. The adsorption of copper on SNR followed first-order kinetics involving the surface complex formation mechanism on the charged surface. Under the optimized conditions the adsorption capacity for copper was found to be 19.65 mg/g of SNR, 1.98 mg/g of FA, and 2.28 mg/g of RM. Thus the adsorption capacity of SNR was found to be more than that of activated carbon, thus making it suitable for the treatment of industrial effluents to reduce the level of copper within the permissible limits for its land disposal (3 mg/L) according to ISI guidelines.
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| Publisher |
John Wiley & Sons
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| Date |
2004-10
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| Type |
Article
PeerReviewed |
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| Format |
application/pdf
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| Language |
en
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| Identifier |
http://eprints.nmlindia.org/2048/1/Agrawal10206.pdf
Agrawal, A and Sahu, K K and Pandey, B D (2004) A Comparative adsorption study of copper on various industrial solid wastes. AIChE Journal, 50 (10). pp. 2430-2438. |
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