Consistent thermal stress evaluation in finite elements
IR@NAL: CSIR-National Aerospace Laboratories, Bangalore
View Archive Info| Field | Value | |
| Title |
Consistent thermal stress evaluation in finite elements
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| Creator |
Prathap, Gangan
Naganarayana, BP |
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| Subject |
Aircraft Design, Testing & Performance
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| Description |
The computation of thermal stresses in displacement finite elements through a formal theoretical basis using the minimum potential principle leads to oscillating stress predictions. Many finite element packages have therefore used an average temperature in simple elements; thermal stresses were computed only at the centroids of such elements to avoid these problems. In this paper we trace this difficulty to a consistency requirement - requirement that stress fields derived from temperature fields (or initial strains) must be consistent with the total strain field interpolations used in the finite element formulation. The principle governing the problem is developed from the minimum total potential theorem and the Hu-Washizu theorem. This gives it a formal rational basis and leads to an orthogonally condition that provides the procedure for determining consistent, thermal stresses in a variationally correct manner. The principle is demonstrated using some simple problems. A four-noded laminated plane-shell element is also considered to prove the rigour and generality of the approach presented here.
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| Date |
1995
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| Type |
Journal Article
PeerReviewed |
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| Identifier |
Prathap, Gangan and Naganarayana, BP (1995) Consistent thermal stress evaluation in finite elements. Computers and Structures, 54 (3). pp. 415-426.
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| Relation |
http://nal-ir.nal.res.in/316/
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