Nano-size copper oxide encapsulated urea – formaldehyde resin film for arsenic (III) removal from aqueous solutions
IR@NISCAIR: CSIR-NISCAIR, New Delhi - ONLINE PERIODICALS REPOSITORY (NOPR)
View Archive Info| Field | Value | |
| Creator |
Rastogi, R P
Singh, N B Shukla, S K |
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| Date |
2011-12-09T11:57:51Z
2011-12-09T11:57:51Z 2011-10 |
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| Identifier |
0975-1017 (Online); 0971-4588 (Print)
http://hdl.handle.net/123456789/13247 |
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| Description |
390-392
The nano-size copper oxide with 40-50 nm dimensions was prepared through KNO<sub>3</sub>: NaNO<sub>3</sub> eutectic melt and encapsulated in urea – formaldehyde (UF) resin during polymerisation. Particle size of CuO was determined by XRD and SEM techniques. CuO encapsulated in urea – formaldehyde resin in the form of film (~5 mm thickness) was used to remove As (III) content from aqueous solution. The process of As (III) removal was found to be efficient and cost effective. |
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| Language |
en_US
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| Publisher |
NISCAIR-CSIR, India
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| Rights |
<img src='http://nopr.niscair.res.in/image/cc-license-sml.png'> <a href='http://creativecommons.org/licenses/by-nc-nd/2.5/in' target='_blank'>CC Attribution-Noncommercial-No Derivative Works 2.5 India</a>
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| Source |
IJEMS Vol.18(5) [October 2011]
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| Subject |
Copper oxide
Nanoparticles Arsenic Urea-formaldehyde XRD SEM |
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| Title |
Nano-size copper oxide encapsulated urea – formaldehyde resin film for arsenic (III) removal from aqueous solutions
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| Type |
Article
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