Studies on nickel electrodeposits on dc magnetron sputtered copper substrates
IR@CECRI: CSIR-Central Electrochemical Research Institute, Karaikudi
View Archive Info| Field | Value | |
| Title |
Studies on nickel electrodeposits on dc magnetron sputtered copper substrates
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| Creator |
Subramanian, B.
Jayakumar, S. Jayachandran, M. Sobha , J. |
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| Subject |
Industrial Metal Finishing
Electrochemical Materials Science |
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| Description |
Investigations into nickel electrodeposits on dc magnetron sputtered copper substrates are
reported. Thin layers of copper were deposited by dc magnetron sputtering on mild steel
substrates. Onto these sputtered copper surface, layers of nickel were electrodeposited using a
Watt’s bath. The coatings were vacuum annealed at 200uC for 120 min. The growth of the deposit
is discussed in terms of structural and microstructural analysis by X-ray diffraction (XRD), SEM
and atomic force microscopy (AFM). The orientation along (111), (200) and (220) was observed
for the vacuum annealed Cu3.8Ni alloy deposits. Uniform and pinhole free morphology was
observed from SEM. AFM images reveal that these coatings have a granular morphology. The
corrosion behaviour of these samples in a 3.5 wt-%NaCl solution was examined. A decrease in
Icorr and high charge transfer resistance indicated the improved corrosion resistant behaviour of
the nickel sample plated over a sputtered copper base.
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| Publisher |
Maney
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| Date |
2005
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| Type |
Article
PeerReviewed |
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| Format |
application/pdf
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| Identifier |
http://cecri.csircentral.net/191/1/098-2005.pdf
Subramanian, B. and Jayakumar, S. and Jayachandran, M. and Sobha , J. (2005) Studies on nickel electrodeposits on dc magnetron sputtered copper substrates. Surface Engineering, 21 (2). pp. 151-155. ISSN 0267-0844 |
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| Relation |
http://cecri.csircentral.net/191/
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