The effect of additives on the pulsed electrodeposition of copper
IR@CECRI: CSIR-Central Electrochemical Research Institute, Karaikudi
View Archive Info| Field | Value | |
| Title |
The effect of additives on the pulsed electrodeposition of copper
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| Creator |
Mohan, S.
Raj, V. |
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| Subject |
Electrodeposition
Industrial Metal Finishing |
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| Description |
The pulsed electrodepostion of copper has been systematically investigated from a copper
sulphate bath. Pulse duty cycles of 5–80%, at frequencies from 10 to 100 Hz with current
densities ranging from 2.5 to 7.5 A dm22 were employed. The influences of pulsed current duty
cycle, peak current density and frequency on the thickness and hardness of the copper deposit,
current efficiency and throwing power of the plating process were studied. The effect of additives,
polyethylene glycol and di-sodium EDTA on the properties of deposit were investigated.
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| Publisher |
Maney Publishing
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| Date |
2005
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| Type |
Article
PeerReviewed |
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| Format |
application/pdf
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| Identifier |
http://cecri.csircentral.net/229/1/118-2005.pdf
Mohan, S. and Raj, V. (2005) The effect of additives on the pulsed electrodeposition of copper. Transactions of the Institute of Metal Finishing, 83 (4). pp. 194-198. ISSN 0020-2967 |
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| Relation |
http://cecri.csircentral.net/229/
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