Electroless deposition of copper from methane sulphonate complexed bath
IR@CECRI: CSIR-Central Electrochemical Research Institute, Karaikudi
View Archive Info| Field | Value | |
| Title |
Electroless deposition of copper from methane sulphonate complexed bath
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| Creator |
Rekha, S.
Srinivasan, K.N. John, S. |
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| Subject |
Industrial Metal Finishing
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| Description |
Electroless copper deposition is widely used for printed circuit applications. A new bath based on
copper methane sulphonate replacing copper sulphate, EDTA and paraformaldehyde has been
developed, which is very useful for plating on non-conductors and through hole plating in printed
circuit manufacturing processes. The new bath has a higher rate of deposition of 3?3 mm h21 than
the conventional sulphate bath (with a rate of 1?5 mm h21) and the bath stability and the quality of
the deposits are very good. Scanning electron microscopy, X-ray diffraction and atomic force
microscopy studies have been carried out and the crystallite size of the copper is measured to be
134 nm with a preferred orientation of 200 planes. The deposit obtained is pure copper and the
surface roughness is of the order of 10 nm.
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| Publisher |
Maney Publishing
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| Date |
2010
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| Type |
Article
PeerReviewed |
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| Format |
application/pdf
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| Identifier |
http://cecri.csircentral.net/562/1/2010-143.pdf
Rekha, S. and Srinivasan, K.N. and John, S. (2010) Electroless deposition of copper from methane sulphonate complexed bath. Transactions of the Institute of Metal Finishing, 88 (4). ISSN 0020-2967 |
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| Relation |
http://cecri.csircentral.net/562/
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